Ravinder S. Dahiya
Ravinder S. Dahiya received B. Tech (honors) in Electrical Engineering from Kurukshetra University (India) in 1999 and M.Tech degree in Control Engineering from Indian Institute of Technology Delhi (India) in 2001. In 2001, he joined Netaji Subhas Institute of Technology Delhi (India) as lecturer. In 2005, he received fellowship from Italian Institute of Technology, Genoa (Italy) to pursue doctoral studies at University of Genoa (Italy) and received his PhD in 2009. During Oct 2008-May 2010, he was post-doctoral researcher at Italian Institute of Technology, Genova (Italy). Since May 2010, he is working as a researcher (Marie Curie Fellow) at Center for Materials and Microsystems, Fondazione Bruno Kessler, Trento (Italy).
His interdisciplinary research interests include Bendable/Flexible Electronics, Electronic Skin, Tactile Sensing System, Smart Materials, and Microsystems. He has published more than sixty research articles and has presented his work at various scientific platforms. He is author of the book ‘Robotic Tactile Sensing – Technologies and System’, published by Springer. In past, he worked on the European Commission funded projects ROBOSKIN and RobotCub. Currently he is leading the ‘FLEXSENSOTRONICS’ project, which aims to build silicon based high-performance bendable/flexible electronic and sensing system such as electronic skin. He is also leading European Commission funded ‘CONTEST’ project. His achievements include the University Gold Medal - awarded to him for securing First Class First Position in the University. He received best paper awards two times in IEEE sponsored conferences.
Ravinder is senior member of IEEE. He is associate Editor of IEEE Transactions on Robotics and guest Editor of IEEE Sensors Journal Special Issue on Flexible Sensors and Sensing Systems. He was the guest Editor of IEEE Transactions on Robotics - Special Issue on Robotic Sense of Touch. He is the representative of IEEE Robotics and Automation Society in the AdCom of IEEE Sensors Council.