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SUMMARY Flexible Sensors and Electronic Systems for Large Areas
Silicon microstructures based approach:
The Silicon microstructures such and wires and ribbons are obtained using top-down fabrication method. The microstructures are transferred printed on flexible subtrates in such as way that electronics components can be finally obtained.
The other method is to develop ultra thin and mechanically flexible silicon chips and transfer them on flexible substrates. This method provides complimentary solution to the silicon microstructures based approach discussed above. Some results are shown in the figures below: